QuantumDiamonds Unveils Quantum Sensing System to Target Chip Yield Crisis

Insider Brief

• QuantumDiamonds has installed its QD m.1 quantum sensing system at Eurofins EAG Laboratories in California, marking its first U.S. deployment and signaling growing adoption of quantum-based semiconductor testing.
• The system enables non-destructive, high-resolution 3D imaging of electrical faults in advanced chips, reducing failure analysis time from hours to minutes and addressing yield challenges in cutting-edge semiconductor manufacturing.
• The deployment reflects increasing industry demand for quantum sensing tools, with major chipmakers already engaged and a roadmap targeting full in-line quality control across semiconductor production.

PRESS RELEASE — QuantumDiamonds GmbH, the Munich-based pioneer in quantum sensing–based semiconductor testing, today announced the successful installation of its QD m.1 system at Eurofins EAG Laboratories in Sunnyvale, California. The deployment marks QuantumDiamonds’ first installation in the United States and is a defining moment in increased production efficiency and yield across the advanced semiconductor ecosystem.

The non-destructive failure analysis that the QuantumDiamonds technology enables provides unparalleled guidance to improved production yields by eliminating failed chips and improving workflow engineering. Low yields in the most advanced chips have delayed sales, increased costs, and slowed innovation. They are also a key cause of the memory chip shortage created by explosive demand for AI.

“Chip fabs are pushing the boundaries of what is physically possible in chip design, and our job is to give them the tools to understand what is happening inside those devices when things go wrong,” said Fleming Bruckmaier, co-founder and CTO of QuantumDiamonds. “The QD m.1 gives engineers a fundamentally new way to analyze and improve advanced packaging and high-density interconnects — non-destructively, in three dimensions, and at a speed that fits their workflow.”

The QD m.1 is the world’s first commercially available, integrated quantum sensing system for semiconductor testing. Based on patented Quantum Diamonds Microscopy (QDM) technology, it delivers non-destructive, high-resolution 3D imaging of current pathways within complex chip architectures — including 2.5D and 3D packages, backside power delivery networks, and wide bandgap devices. Unlike conventional optical techniques, which require destructive layer-by-layer sample preparation, the QD m.1 localizes electrical faults — including opens, the industry’s number one yield-killing failure mode — as intuitive visual markers, compressing failure analysis cycles from hours to minutes.

Eurofins EAG Laboratories, one of the world’s most respected independent providers of materials characterization, failure analysis, and semiconductor testing services, selected the QD m.1 to extend its failure analysis capabilities for customers operating at the most advanced technology nodes and packaging architectures. The system is now fully operational at Eurofins EAG’s Sunnyvale facility, situated at the heart of Silicon Valley’s global semiconductor community. The installation builds on a longstanding and productive collaboration between QuantumDiamonds and Eurofins EAG Laboratories.

“Eurofins EAG Laboratories is exactly the right partner to introduce quantum sensing to the North American semiconductor market,” said Kevin Berghoff, co-founder and CEO of QuantumDiamonds. “Their partnership is a signal to the entire US semiconductor ecosystem that quantum sensing is here, it works, and it is ready for the most demanding challenges in the field.”

The US installation comes as QuantumDiamonds experiences strong and growing demand across the global semiconductor ecosystem, with nine of the world’s top ten chipmakers already engaged with the company. The QD m.1 is being deployed at leading failure analysis laboratories and semiconductor manufacturers worldwide, with active validation engagements underway across Asia’s most advanced chip manufacturing markets.

The company’s product roadmap progresses from the current InLab defect localization system through InFab defect metrology (est. 2027) to InLine wafer mapping (est. 2028+) to 100% in-line quantum sensing–based quality control for every chip produced.