Path to Large Scale Qubits and Super Quantum Computers

CEA-Leti scientists have opened a pathway to large-scale integration of Si-spin qubits using existing flip-chip processes with die-to-wafer 3D-interconnect technologies developed in-house. They determined electrical characterizations at cryogenic temperatures of chip assemblies made with 3D interconnects such as SnAg microbumps and direct Cu bonded pads from Cu/SiO2 hybrid bonding process. SnAg microbumps have the advantage of being widely used in the 3D IC community, and the processes to fabricate them are well known at CEA-Leti with a state-of-the-art pitch as low as 20µm. The motivation to study Cu/SiO2 hybrid bonding lies in its high-resolution potential with a pitch as low

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