Insider Brief Quantinuum has reportedly increased the size and pricing of its IPO, raising its potential valuation to approximately $14.3 billion. According to Barron’s, the company plans to offer 26.5 million shares at $53 to […]
Quantum 10, 2125 (2026). https://doi.org/10.22331/q-2026-06-02-2125 We construct a local decoder for the 2D toric code using ideas from the hierarchical classical cellular automata of Tsirelson and Gács. Our decoder is a circuit of strictly local […]
By Keith Martin, Professor, Information Security Group, Royal Holloway, University of London and Briana Bowen, Postgraduate research student, Department of Information Security, Royal Holloway, University of London for The Conversation Quantum computers are coming. Or, […]
Insider Brief D-Wave used its first investor day at the New York Stock Exchange to argue that its dual strategy of developing both annealing and gate-model quantum computers positions it to address a broader range […]
Insider Brief NATO DIANA has opened applications for its 2027 accelerator cohort, seeking dual-use technology solutions across six defence and security challenge areas, with submissions due July 3, 2026. Selected innovators will receive €100,000 in […]
Scientists have created a tiny chip that can generate, steer, and read light-based information all in one device, marking a major leap toward ultra-fast, energy-efficient computing. The breakthrough uses atomically thin materials and nanoscale structures […]
This week, Yuval Bogar interviews Sebastian Hassinger, host of The New Quantum Era podcast, and author of a new book by the same name. Sebastian and Yuval have many things in common beyond their jobs […]
Acronym: QNLPAI ’26 Dates: Friday, August 14, 2026 to Sunday, August 16, 2026 Web page: Quantum AI 2026 Registration deadline: Saturday, August 1, 2026 Submission deadline: Sunday, June 21, 2026 Tags: artificial inteligence quantum computing […]
Quantum entanglement is a state in which particles are entwined with each other. In this entwined state, the properties of one particle influence the other, even when they aren’t physically close to each other. This […]
Insider Brief Researchers at the University of Illinois developed a low-temperature process for sequentially stacking silicon transistor layers, enabling monolithic 3D chip integration while remaining within industry thermal limits. The team demonstrated three vertically stacked […]
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