D-Wave Quantum Advances Cryogenic Packaging for Multichip Quantum Processor Interconnect

D-Wave Quantum Inc. (NYSE: QBTS) has announced a new strategic development initiative focused on advanced cryogenic packaging. This initiative is designed to improve packaging capabilities, equipment, and processes, with the aim of advancing and scaling both gate model and annealing quantum processor development. The effort builds on D-Wave’s technology in superconducting cryogenic packaging. As part […]

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